Table of Contents
　　Executive Summary
　　Introduction
　　Asia Foundry Overview
　　　　Factors Driving Semiconductor Capacity in Asia
　　300mm Fabs in Asia
　　Semiconductor Process Development Alliances and Joint Ventures
　　Asia Capex Overview
　　Asia Semiconductor Manufacturing Capacity by Country, 2006–2011
　　　　Asia Semiconductor Manufacturing Capacity
　　　　Foundry Process Technology Comparison
　　Taiwan Semiconductor Manufacturing Overview
　　　　TSMC
　　　　UMC
　　　　Powerchip Semiconductor Corporation (PSC)
　　　　ProMOS Technologies
　　　　Winbond
　　　　Nanya Technology and Inotera Memory
　　South Korea Semiconductor Manufacturing Overview
　　　　Samsung
　　　　Hynix
　　　　MagnaChip
　　　　DongbuAnam
　　　　　　Drivers
　　　　　　Challenges
　　China Semiconductor Manufacturing Overview
　　　　SMIC
　　　　　　Drivers
　　　　　　Challenges
　　Singapore Semiconductor Manufacturing Overview
　　　　Chartered
　　　　　　Drivers
　　　　　　Challenges
　　Japan Semiconductor Manufacturing Overview
　　　　Drivers
　　　　Challenges
　　Malaysia Semiconductor Manufacturing Overview
　　　　Drivers
　　　　Challenges
　　Others
　　　　ndia
　　　　　　Drivers
　　　　　　Challenges
　　　　Vietnam
　　　　　　Drivers
　　　　　　Challenges
　　Conclusion
　　Methodology
　　Related In-Stat Reports
List of Tables
　　Table 1. Asia 300mm Fabs, 2006
　　Table 2. Asia Upcoming 300mm Fabs
　　Table 3. Asia Foundry Capital Expenditure, 2003–2007, (US$ in Billions)
　　Table 4. Asia Memory Capital Expenditure, 2003–2007 (US$ in Billions)
　　Table 5. TSMC Fabs Overview
　　Table 6. TSMC Process Technology Trend, 2003–2007
　　Table 7. UMC Fabs Overview
　　Table 8. UMC Process Technology Trend, 2003–2007
　　Table 9. Taiwan Memory Fabs Overview
　　Table 10. Samsung Fabs Overview
　　Table 11. Hynix Fabs Overview
　　Table 12. MagnaChip Fabs Overview
　　Table 13. DongbuAnam Fabs Overview
　　Table 14. SMIC Fabs Overview
　　Table 15. SMIC Process Technology Trend, 2003–2007
　　Table 16. Other Leading Fabs in China
　　Table 17. Chartered Fabs Overview
　　Table 18. Chartered Process Technology Trend, 2003–2007
　　Table 19. Singapore Other Leading Fabs
　　Table 20. Japan 300mm Fabs Overview
　　Table 21. Malaysia Fabs Overview
List of Figures
　　Figure 1. Asia Semiconductor Manufacturing Capacity, 2006 (200mm-eq. Wafers/Month, in Thousands)
　　Figure 2. 300mm Wafer Share in Asia Semiconductor Manufacturing Capacity, 2006 (in 200mm-eq. Wafers)
　　Figure 3. Asia Foundry Capital Expenditure, 2003–2007, (US$ in Billions)
　　Figure 4. Asia Memory Capital Expenditure, 2003–2007, (US$ in Billions)
　　Figure 5. Asia Semiconductor Manufacturing Capacity, 2006–2011 (200mm-eq. Wafers/Month, in Thousands)
　　Figure 6. Foundry Capacity Comparison by Process Technology, 2006
　　Figure 7. Taiwan Semiconductor Manufacturing Capacity, 2006–2011 (200mm-eq. Wafers/Month, in Thousands)
　　Figure 8. TSMC Process Technology Trend, 2003–2007
　　Figure 9. UMC Process Technology Trend, 2003–2007
　　Figure 10. South Korea Semiconductor Manufacturing Capacity, 2006–2011 (200mm-eq. Wafers/Month, in Thousands)
　　Figure 11. China Semiconductor Manufacturing Capacity, 2006–2011 (200mm-eq. Wafers/Month, in Thousands)
　　Figure 12. SMIC Process Technology Trend, 2003–2007
　　Figure 13. Singapore Semiconductor Manufacturing Capacity, 2006–2011 (200mm-eq. Wafers/Month, in Thousands)
　　Figure 14. Chartered Process Technology Trend, 2003–2007
　　Figure 15. Japan Semiconductor Manufacturing Capacity, 2006–2011 (200mm-eq. Wafers/Month, in Thousands)
　　Figure 16. Malaysia Semiconductor Manufacturing Capacity, 2006–2011 (8-inch-eq. Wafers/Month, in Thousands)